AI DATA CENTER
POWER CONVERSION
AmberSemi’s PowerTile™
Vertical Power for AI Data Centers
AmberSemi’s new PowerTile™ DC-DC power conversion solution for AI datacenters provides the first viable path to vertical power delivery that will support not only today’s but also tomorrow’s growing power demands.
New advancements in datacenter processors driven by market leaders like Nvidia, AMD and Intel are creating tremendous strain on what is possible from power delivery. The standard lateral power delivery systems are stretched to their limit due to power losses caused by their own efficiencies, as well as the major power losses created by their inherent distance from where the power must be delivered. The 1,500A of today’s processors have substantial PDN losses. Scaling for the future using these architectures is not viable.

Amber has developed a solution that supplies 1,000A in a 20x24x1.68mm package vertically that can be combined for systems at 10,000A+. This virtually eliminates the losses created by lateral power delivery. Furthermore, Amber’s 1.6mm height allows for liquid cooling of the power supply (which is necessary at these power levels) and yet still allows for server form-factor reduction for increased server performance. As the market continues to scale power needs, and even as internal architectures shrink further, Amber’s solution provides a scalable path forward and will support all major processor manufacturers: Nvidia, AMD, and Intel.
Amber is redefining the power conversion architecture entirely and will be the power platform of the future.

Industry giants like Nvidia and AMD are pushing the boundaries of performance and power demands…
The PowerTile emerges as a timely solution …
offering extremely high current delivery in a compact form factor that can be mounted beneath the processor for a more efficient power path.
SILICON FLASH / MARCH 2026


Strategic Advantages
- Industry’s highest power density
- A single AmberSemi PowerTile™ replaces over 33 power ICs for higher performance and reliability
- Support for next generation of processor power requirements
- Ultra low profile for backside placement
- Nearly total elimination of PDN (power delivery network) losses across PCB
- Optimized designs for thermal cooling

20 x 24 x 1.68mm
VERTICAL POWER DELIVERY
1000A
PER CHIP
“As data centers grapple with escalating power demands…
innovative solutions like the PowerTile are poised to shape the future of AI infrastructure.”
– SILICON FLASH / MARCH 2026
How We Do It
Key Technology Differentiators
INTEGRATED MAGNETICS
High density magnetic structures optimized for high current power switching
SEMICONDUCTOR PHYSICS
Optimized FET structures and process for high density integration

ADVANCED PACKAGING
3D packaging techniques to integrate silicon, inductors & capacitance in small form factor
DIGITAL CONTROL
Advanced Digital Control scheme for fast transit response

Download the Latest AmberSemi Whitepaper
A white paper discussing the rapidly growing energy crisis, highlighting the need to rethink power architecture to boost data center power efficiency.
